The presentation starts with an introduction to memory systems in computing devices such as computers, tablets or smartphones. Then, an in-depth analysis of standard memory systems for low-power and high-performance applications is provided. The interactions between the signaling, clocking architecture and packaging technology of a memory interface as well as how these interactions determine the achievable data rates and power efficiency are discussed. Signaling and clocking schemes for standard memories, including DDR3 and DDR4 (DDR5), and mobile memories, such as LPDDR3 and LPPDR4 (LPDDR5) are detailed and compared against each other. The emerging 2.5D/3D memory systems such as HBM1/2/2E, and HMC1/2 and beyond are also presented. Packaging options such as BGA, PoP, and the emerging 2.5D/3D are also discussed. To analyze and compare different state-of-the-art memory interfaces, the following metrics are used in the analysis: cost, power efficiency, bandwidth, design complexity, signal and power integrity, thermal solution, and form factor. The audience will gain an in-depth understanding of high-speed memory interfaces; learn about the interactions between the signaling, clocking architecture and packaging technology of a memory interface, and find out how those interactions determine the achievable data rates and power efficiency. The presentation will conclude by demonstrating how this knowledge can be used to analyze and compare different state-of-the-art memory interfaces to help attendees implement or select a solution which best fits their specific application. Co-sponsored by: STARaCom Speaker(s): Dr. Wendem Beyene, Room: 603, Bldg: McConnell Eng. Building , McGill University, 3480 University St, Montreal, Quebec, Canada, H3A0E9, Virtual: https://events.vtools.ieee.org/m/324273